Products

Samsung SDI

Create a win-win situation together through meticulous and profession services.

Products

Samsung SDI

Founded in 1970, Samsung SDI celebrates its 50th anniversary in 2020.  Global network consist of a total of 30 locations, including the Headquarters, the R&D Center, production facilities and sales bases.

EMC (Epoxy Molding Compound)

Starting from the development of semiconductor process material EMC in 1994 which is designed to protect semiconductor circuits from factors in external environment.  By using advanced technology and based of professional strength, Samsung SDI continues to maintain the world’s top level of business competitiveness.

Product table

EMC effectively protects semiconductor circuits from factors in the external environment such as moisture, heat, and shock.  It applications include memory, system LSI, individual devices, and so on.

MUF EMCPoP-t EMCGranule EMC
Excellent assembly yield improvementBest solution for Warpage controlExcellent moldability with higher spreadability
Curable at low temperatureExcellent yield improvementShort cure time for higher productivity
Best productivityMaximizing customer’s productivityExcellent granule size control
Wide process windowWide process windowWide process window
GradeUnitSG-8500AGMSG-8500RMBSG-8500MGSG-8300UF
EMC type–GranuleGranuleGranuleGranule
Filler over cut sizeum45454520
Mold shrinkage%0.110.250.190.25
Spiral flowcm58129155145
Gelation time(175℃)sec52434531
Flexural Modulus(RT)MPa27887307572304724543
Tg℃148124133145
C.T.E (α1)ppm/℃8281013
C.T.E (α2)ppm/℃321243852

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Mail: sharon@rfhco.net

Address: 4F-2, No.267, Lequn 2nd Rd., Zhongshan Dist., Taipei City 104452, Taiwan

Tel: +886-2-85029971

Mail: sharon@rfhco.net

Address: 4F-2, No.267, Lequn 2nd Rd., Zhongshan Dist., Taipei City 104452, Taiwan

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